izindaba

Ubuchwepheshe bokusika izintambo zedayimane buyaziwa nangokuthi ubuchwepheshe bokusika obunama-abrasive abrasive.Kuwukusetshenziswa kwendlela ye-electroplating noma ye-resin bonding ye-diamond abrasive ehlanganiswe phezu kocingo lwensimbi, ucingo lwedayimane olusebenza ngokuqondile phezu kwenduku ye-silicon noma i-silicon ingot ukukhiqiza ukugaya, ukufeza umphumela wokusika.I-Diamond wire cutting inezici zejubane lokusika ngokushesha, ukunemba okuphezulu kokusika kanye nokulahlekelwa kwezinto eziphansi.

Njengamanje, imakethe ye-crystal eyodwa ye-diamond wire cutting silicon wafer yamukelwe ngokugcwele, kodwa nayo ihlangabezane nenqubo yokukhushulwa, phakathi kwayo i-velvet white inkinga evamile kakhulu.Ngenxa yalokhu, leli phepha ligxile ekuvimbeleni ukusika kwe-diamond wire monocrystalline wafer velvet inkinga emhlophe.

Inqubo yokuhlanza yocingo lwedayimane olusikwa i-monocrystalline silicon wafer ukususa isicwecwana se-silicon esisikwe ithuluzi lomshini wokusaha ocingweni epuleti le-resin, khipha umucu werabha, futhi uhlanze iwafa ye-silicon.Imishini yokuhlanza iwumshini wokuhlanza ngaphambili (umshini wokukhipha i-degumming) kanye nomshini wokuhlanza.Inqubo yokuhlanza eyinhloko yomshini wokuhlanza wangaphambi kokuhlanza ithi: feeding-spray-spray-ultrasonic cleaning-degumming-clean water rinsing-underfeeding.Inqubo yokuhlanza eyinhloko yomshini wokuhlanza yilezi: ukuphakela-amanzi ahlanzekile ukuhlanza-amanzi ahlanzekile ukuhlanza-i-alkali ukugeza-i-alkali ukugeza-amanzi ahlanzekile ukuhlanza-amanzi ahlanzekile ukuhlanza-ngaphambi kokukhipha amanzi emzimbeni (ukuphakamisa kancane) -ukomisa-ukudla.

Umgomo wokwenza i-velvet ye-crystal eyodwa

I-Monocrystalline silicon wafer iyisici sokugqwala kwe-anisotropic ye-monocrystalline silicon wafer.Isimiso sokusabela yile equation yokusabela kwamakhemikhali elandelayo:

Si + 2NaOH + H2O = Na2SiO3 + 2H2↑

Empeleni, inqubo yokwakheka kwe-suede yilena: Isixazululo se-NaOH sezinga lokugqwala elihlukile le-crystal surface ehlukene, (100) isivinini sokugqwala kwangaphezulu kune-(111), ngakho-ke (100) kuya esicwecweni se-silicon se-monocrystalline ngemuva kokugqwala kwe-anisotropic, ekugcineni sakhiwe phezu (111) ikhoni enezinhlangothi ezine, okuyisakhiwo “sephiramidi” (njengoba kuboniswe emfanekisweni 1).Ngemva kokwakhiwa kwesakhiwo, lapho ukukhanya kwenzeka endaweni yethambeka yephiramidi ku-Engeli ethile, ukukhanya kuzoboniswa emthambekeni kwenye i-Angle, kwakheka ukumuncwa kwesibili noma ngaphezulu, ngaleyo ndlela kunciphisa ukubonakaliswa ebusweni be-silicon wafer. , okungukuthi, umphumela womgibe wokukhanya (bheka Umfanekiso 2).Okungcono usayizi nokufana kwesakhiwo "sephiramidi", umphumela wogibe osobala kakhulu, kanye ne-emitrate engaphezulu ye-silicon wafer.

Umfanekiso 1: I-Micromorphology ye-monocrystalline silicon wafer ngemva kokukhiqizwa kwe-alkali

Umfanekiso wesi-2: Umgomo womgibe okhanyayo wesakhiwo "sephiramidi".

Ukuhlaziywa kokumhlophe kwekristalu eyodwa

Ngokuskena isibonakhulu se-electron esicwecweni se-silicon esimhlophe, kwatholakala ukuthi i-pyramid microstructure ye-wafer emhlophe endaweni empeleni ayizange yakheke, futhi ubuso bubonakala bunongqimba lwezinsalela "ze-waxy", kuyilapho isakhiwo sephiramidi se-suede. endaweni emhlophe ye-silicon wafer efanayo kwakhiwa kangcono (bheka Umfanekiso 3).Uma kunezinsalela phezu kwesicwecwana se-silicon ye-monocrystalline, indawo engaphezulu izoba nendawo eyinsalela yobukhulu besakhiwo “sephiramidi” kanye nokukhiqizwa okufanayo kanye nomphumela wendawo evamile awanele, okuholela ekutheni i-velvet surface reflectivity ibe phezulu kunendawo evamile, indawo enokubonakala okuphezulu uma kuqhathaniswa nendawo evamile esibukweni eboniswa njengokumhlophe.Njengoba kungabonakala ekubunjweni kokusabalalisa kwendawo emhlophe, akusiyo isimo esivamile noma esivamile endaweni enkulu, kodwa kuphela ezindaweni zendawo.Kufanele kube ukuthi ukungcola kwendawo okungaphezulu kwe-silicon wafer akuzange kuhlanzwe, noma isimo esingaphezulu se-silicon wafer sibangelwa ukungcoliswa kwesibili.

Umfanekiso 3: Ukuqhathaniswa komehluko wesifunda se-microstructure kumawafa e-silicon emhlophe e-velvet

Ingaphezulu lewafa ye-silicon yokusika ucingo lwedayimane bushelelezi kakhulu futhi umonakalo mncane (njengoba kuboniswe kuMfanekiso 4).Uma kuqhathaniswa nodaka lwe-silicon wafer, isivinini sokusabela se-alkali kanye ne-diamond wire yokusika i-silicon wafer surface ihamba kancane kunaleso lesicwecwana esisika udaka i-monocrystalline silicon, ngakho umthelela wezinsalela zangaphezulu kumphumela wevelvet ubonakala kakhudlwana.

Umfanekiso 4: (A) I-Micrograph engaphezulu ye-silicone wafer esike udaka (B) i-micrograph engaphezulu ye-diamond wire cut silicon wafer

Umthombo oyinhloko oyinsalela we-diamond wire-cut silicon wafer surface

(1) Isipholile: izingxenye eziyinhloko ze-diamond wire cutting coolant ziyi-surfactant, dispersant, defamagent namanzi nezinye izakhi.I-liquid yokusika esebenza kahle kakhulu inokumiswa okuhle, ukusabalalisa kanye nekhono lokuhlanza kalula.Ama-surfactants ngokuvamile anezindawo ezingcono ze-hydrophilic, okulula ukuzihlanza kunqubo yokuhlanza i-silicon wafer.Ukunyakaziswa okuqhubekayo kanye nokujikeleza kwalezi zithako emanzini kuzokhiqiza igwebu elikhulu, okuholela ekwehleni kokugeleza kokupholisa, kuthinte ukusebenza kokupholisa, kanye nezinkinga ezingathi sína zegwebu ngisho nokuchichima kwegwebu, okuzothinta kabi ukusetshenziswa.Ngakho-ke, into epholile ngokuvamile isetshenziswa ne-ejenti yokukhipha amagwebu.Ukuze kuqinisekiswe ukusebenza kwe-defoaming, i-silicone yendabuko kanye ne-polyether ngokuvamile i-hydrophilic embi.I-solvent emanzini kulula kakhulu ukuyikhanga futhi ihlale phezu kwe-silicon wafer ekuhlanzeni okulandelayo, okuholela enkingeni yendawo emhlophe.Futhi ayihambisani kahle nezingxenye eziyinhloko zokupholisa, Ngakho-ke, kufanele yenziwe izingxenye ezimbili, Izingxenye Eziyinhloko kanye nama-defoaming agents zengezwa emanzini, Ngesikhathi sokusebenzisa, ngokusho kwesimo segwebu, Ayikwazi ukulawula inani ukusetshenziswa kanye nomthamo wama-antifoam agents, Kungavumela kalula ukweqisa kwe-anoaming agents, Okuholela ekwandeni kwezinsalela ze-silicon wafer surface, Kubuye kube nzima kakhulu ukusebenza, Nokho, ngenxa yentengo ephansi yezinto zokusetshenziswa kanye ne-ejenti yokukhipha amagwebu eluhlaza. izinto zokwakha, Ngakho-ke, izinto ezipholile eziningi zasekhaya zonke zisebenzisa lolu hlelo lwefomula;Enye into epholile isebenzisa i-ejenti entsha yokukhipha amagwebu, Ingakwazi ukuhambisana kahle nezingxenye eziyinhloko, Azikho izengezo, Ingakwazi ukulawula inani laso ngempumelelo nangesilinganiso, Ingakwazi ukuvimbela ngempumelelo ukusetshenziswa ngokweqile, Ukuzivocavoca nakho kulula kakhulu ukukwenza, Ngenqubo yokuhlanza efanele, izinsalela zingalawulwa zibe emazingeni aphansi kakhulu, EJapane futhi abakhiqizi abambalwa basekhaya bamukela lolu hlelo lwefomula, Nokho, ngenxa yezindleko zayo eziphakeme zempahla eluhlaza, inzuzo yayo yentengo ayibonakali.

(2) Inguqulo yeglue ne-resin: esigabeni sakamuva senqubo yokusika intambo yedayimane, Iwafa ye-silicon eduze nesiphetho esingenayo isinqunywe kusengaphambili, Iwafa ye-silicon ekugcineni ayikanqunywa, Idayimane elisikiwe lakuqala. ucingo seluqalile ukusika ungqimba lwenjoloba kanye nepuleti le-resin, Njengoba i-silicon rod glue kanye nebhodi le-resin kokubili kuyimikhiqizo ye-epoxy resin, indawo yayo yokuthambisa iphakathi kuka-55 no-95 ℃, Uma indawo yokuthambisa yongqimba yenjoloba noma inhlaka. ipuleti liphansi, lingashisisa kalula phakathi nenqubo yokusika futhi libangele ukuthi lithambe futhi lincibilike, Linamathiselwe ocingweni lwensimbi nendawo ecwecwana ye-silicon, Ibangele ikhono lokusika lomugqa wedayimane lehle, Noma amawafa e-silicon atholwa futhi ingcoliswe nge-resin, Uma isinamathiselwe, kuba nzima kakhulu ukuyigeza, Ukungcola okunjalo kuvame ukuvela eduze konqenqema lwewafa ye-silicon.

(3) i-silicon powder: inqubo yokusika idayimane yocingo izokhiqiza i-silicon powder eningi, ngokusika, okuqukethwe kwempushana okupholisayo kuzoba phezulu kakhulu, lapho impushana inkulu ngokwanele, izonamathela ebusweni be-silicon, nokusikwa kwentambo yedayimane yosayizi we-silicon powder nosayizi kuholela ekubeni kube lula ukukhangiswa endaweni ye-silicon, kwenza kube nzima ukuyihlanza.Ngakho-ke, qinisekisa ukubuyekezwa kanye nekhwalithi yesipholile futhi unciphise okuqukethwe kwempushana esipholisayo.

(4) i-ejenti yokuhlanza: ukusetshenziswa kwamanje kwabakhiqizi bokusika izintambo zedayimane ikakhulukazi abasebenzisa ukusika udaka ngesikhathi esifanayo, ikakhulukazi zisebenzisa i- mortar cutting prewashing, inqubo yokuhlanza kanye ne-ejenti yokuhlanza, njll., ubuchwepheshe bokusika intambo yedayimane eyodwa kusuka kumshini wokusika, yakha isethi ephelele yomugqa, ukusika okupholisayo nodaka kunomehluko omkhulu, ngakho-ke inqubo yokuhlanza ehambisanayo, umthamo we-ejenti yokuhlanza, ifomula, njll kufanele kube yi-diamond wire cutting yenza ukulungiswa okuhambisanayo.I-ejenti yokuhlanza iyisici esibalulekile, i-agent yokuqala yokuhlanza ifomula ye-surfactant, i-alkalinity ayifanele ukuhlanza i-silicon wafer yocingo lwedayimane, kufanele ibe yindawo ecwecwana ye-silicon yocingo lwedayimane, ukwakheka nezinsalela zangaphezulu ze-ejenti yokuhlanza ehlosiwe, futhi uthathe inqubo yokuhlanza.Njengoba kushiwo ngenhla, ukwakheka kwe-ejenti yokukhipha amagwebu akudingekile ekusikeni kodaka.

(5) Amanzi: ukusika izintambo zedayimane, ukuwashwa kwangaphambili kanye nokuhlanza amanzi aphuphumayo aqukethe ukungcola, kungase kukhangiswe phezu kwewafa ye-silicon.

Yehlisa inkinga yokwenza izinwele ze-velvet ezimhlophe zivele iziphakamiso

(1) Ukusebenzisa okokupholisa ngokuhlakazwa kahle, futhi into epholisayo iyadingeka ukusebenzisa i-ejenti yokukhipha amagwebu enensalela encane ukunciphisa insalela yezingxenye zokupholisa ebusweni besiluli sesilicon;

(2) Sebenzisa i-glue efanelekile nepuleti le-resin ukunciphisa ukungcoliswa kwe-silicon wafer;

(3) Isipholile sihlanjululwa ngamanzi ahlanzekile ukuze kuqinisekiswe ukuthi akukho ukungcola okulula okuyinsalela emanzini asetshenzisiwe;

(4) Ngobuso besicwecwana se-silicon esikiwe ngocingo lwedayimane, sebenzisa umsebenzi nomphumela wokuhlanza ofaneleka kakhulu;

(5) Sebenzisa uhlelo lwedayimane olupholisayo lwe-inthanethi lokubuyisela ukuze unciphise okuqukethwe kwempushana ye-silicon enqubweni yokusika, ukuze ulawule ngempumelelo insalela yempushana ye-silicon ebusweni be-silicon wafer of the wafer.Ngesikhathi esifanayo, kungase futhi andise ngcono izinga lokushisa kwamanzi, ukugeleza kanye nesikhathi in the pre-washing, ukuqinisekisa ukuthi powder Silicon wageza ngesikhathi.

(6) Uma isicwecwana se-silicon sesibekwe etafuleni lokuhlanza, kufanele siphathwe ngokushesha, futhi sigcine isicwecwana se-silicon simanzi phakathi nayo yonke inqubo yokuhlanza.

(7) Iwafa ye-silicon igcina ingaphezulu imanzi ngesikhathi sokukhishwa kwe-degumming, futhi ayikwazi ukoma ngokwemvelo.8

(9) Abasebenzi abahlanzayo akufanele baxhumane ngqo nobuso bewafa ye-silicon phakathi nayo yonke inqubo yokuhlanza, futhi kufanele bagqoke amagilavu ​​enjoloba, ukuze bangakhiqizi izigxivizo zeminwe.

(10) Ngokubhekisela [2], ukuphela kwebhethri kusebenzisa i-hydrogen peroxide H2O2 + inqubo yokuhlanza ye-alkali NaOH ngokwesilinganiso sevolumu ye-1:26 (isixazululo se-3% NaOH), esinganciphisa ngempumelelo ukuvela kwenkinga.Umgomo wayo ufana nesixazululo se-SC1 sokuhlanza (esivame ukwaziwa ngokuthi uketshezi 1) se-semiconductor silicon wafer.Indlela yayo eyinhloko: ifilimu ye-oxidation endaweni ye-silicon wafer yakhiwa i-oxidation ye-H2O2, egqwala yi-NaOH, futhi i-oxidation nokugqwala kwenzeka ngokuphindaphindiwe.Ngakho-ke, izinhlayiya ezixhunywe ku-silicon powder, i-resin, insimbi, njll.) nazo ziwela oketshezini lokuhlanza ngesendlalelo sokugqwala;ngenxa ye-oxidation ye-H2O2, i-organic matter endaweni eyi-wafer ibola ibe yi-CO2, i-H2O futhi isuswe.Le nqubo yokuhlanza kube abakhiqizi be-silicon wafer abasebenzisa le nqubo ukucubungula ukuhlanzwa kocingo lwedayimane olusikwa i-monocrystalline silicon wafer, i-silicon wafer yasekhaya naseTaiwan kanye nabanye abakhiqizi bebhethri abasebenzisa inqwaba yezikhalazo zenkinga emhlophe yevelvet.Kukhona futhi abakhiqizi bebhethri abasebenzise inqubo efanayo yokuhlanza i-velvet ngaphambili, futhi balawule ngempumelelo ukubukeka kwe-velvet emhlophe.Kungabonakala ukuthi le nqubo yokuhlanza yengezwe kunqubo yokuhlanza i-silicon wafer ukususa izinsalela ze-silicon wafer ukuze kuxazululwe ngempumelelo inkinga yezinwele ezimhlophe ekugcineni kwebhethri.

isiphetho

Njengamanje, ukusika izintambo zedayimane sekuphenduke ubuchwepheshe obuyinhloko bokucubungula emkhakheni wokusika ikristalu eyodwa, kodwa inqubo yokuthuthukisa inkinga yokwenza i-velvet emhlophe ibilokhu ikhathaza i-silicon wafer kanye nabakhiqizi bebhethri, okuholela kubakhiqizi bebhethri ukusika i-silicon ye-diamond wire. I-wafer inokumelana okuthile.Ngokuhlaziywa kokuqhathanisa kwendawo emhlophe, kubangelwa ikakhulukazi izinsalela ebusweni be-wafer ye-silicon.Ukuze kuvinjwe kangcono inkinga ye-silicon wafer esitokisini, leli phepha lihlaziya imithombo engaba khona yokungcoliswa kwendawo ye-silicon wafer, kanye neziphakamiso zokuthuthukisa kanye nezinyathelo ekukhiqizeni.Ngokwenombolo, isifunda kanye nokuma kwamabala amhlophe, izimbangela zingahlaziywa futhi zithuthukiswe.Kunconywa ikakhulukazi ukusebenzisa i-hydrogen peroxide + inqubo yokuhlanza i-alkali.Okuhlangenwe nakho okuphumelelayo kufakazele ukuthi kungavimbela ngempumelelo inkinga yokusika i-silicon wafer eyenza i-velvet ibe mhlophe, ukuze kubhekiselwe kwabangaphakathi embonini evamile nabakhiqizi.