izindaba

Ubuchwepheshe bokusika izintambo zedayimane buyaziwa nangokuthi ubuchwepheshe bokusika izintambo eziqinile. Kuwukusetshenziswa kwendlela yokubopha nge-electroplating noma i-resin ye-diamond abrasive ehlanganiswe ebusweni bentambo yensimbi, intambo yedayimane isebenza ngqo ebusweni benduku ye-silicon noma i-silicon ingot ukukhiqiza ukugaya, ukufeza umphumela wokusika. Ukusika izintambo zedayimane kunezici zesivinini sokusika esisheshayo, ukunemba okuphezulu kokusika kanye nokulahleka okuphansi kwezinto.

Njengamanje, imakethe yekristalu eyodwa yokusika i-silicon wafer yedayimane iye yamukelwa ngokugcwele, kodwa futhi ihlangane nayo enkambisweni yokukhushulwa, phakathi kwayo okuyinkinga evame kakhulu yi-velvet white. Ngenxa yalokhu, leli phepha ligxile endleleni yokuvimbela inkinga yedayimane yokusika i-silicon wafer ye-monocrystalline velvet white.

Inqubo yokuhlanza yokusika i-wafer ye-silicon yedayimane e-monocrystalline iwukususa i-wafer ye-silicon esikwe yithuluzi lomshini we-wire saw epuletini le-resin, isuse umugqa werabha, bese ihlanza i-wafer ye-silicon. Imishini yokuhlanza ngokuyinhloko umshini wokuhlanza ngaphambi kokuhlanza (umshini wokususa i-gumming) kanye nomshini wokuhlanza. Inqubo eyinhloko yokuhlanza ngaphambi kokuhlanza yile: ukondla-i-spray-spray-ultrasonic yokuhlanza-i-degumming-ukuhlanza amanzi ahlanzekile ukuhlanza-ukudla okungaphansi. Inqubo eyinhloko yokuhlanza yomshini wokuhlanza yile: ukondla-amanzi ahlanzekile ukuhlanza-amanzi ahlanzekile ukuhlanza-i-alkali ukuwasha-i-alkali ukuwasha-amanzi ahlanzekile ukuhlanza-amanzi ahlanzekile ukuhlanza-amanzi ahlanzekile ngaphambi kokuphelelwa amanzi emzimbeni (ukuphakamisa kancane) -ukomisa-ukudla.

Umgomo wokwenza i-velvet enekristalu elilodwa

I-wafer ye-silicon e-monocrystalline iyisici sokugqwala kwe-anisotropic kwe-wafer ye-silicon e-monocrystalline. Umgomo wokusabela yi-equation yokusabela kwamakhemikhali elandelayo:

Si + 2NaOH + H2O = Na2SiO3 + 2H2↑

Empeleni, inqubo yokwakheka kwe-suede yile: Isixazululo se-NaOH sezinga lokugqwala elihlukile le-crystal surface ehlukene, (100) isivinini sokugqwala kobuso kune-(111), ngakho-ke (100) ku-silicon wafer ye-monocrystalline ngemuva kokugqwala kwe-anisotropic, ekugcineni kwakheka ebusweni be-(111) cone enezinhlangothi ezine, okungukuthi isakhiwo "se-pyramid" (njengoba kuboniswe kumfanekiso 1). Ngemva kokwakheka kwesakhiwo, lapho ukukhanya kungena emthambekeni we-pyramid ku-Angle ethile, ukukhanya kuzobonakala emthambekeni kwenye i-Angle, kwakha ukumuncwa kwesibili noma ngaphezulu, ngaleyo ndlela kunciphisa ukubonakaliswa ebusweni be-silicon wafer, okungukuthi, umphumela we-light trap (bheka Umfanekiso 2). Uma usayizi kanye nokufana kwesakhiwo "se-pyramid" kungcono, umphumela we-trap ubonakala kakhulu, futhi i-surface emitrate ye-silicon wafer iphansi.

Umfanekiso 1: I-Micromorphology ye-monocrystalline silicon wafer ngemva kokukhiqizwa kwe-alkali

Umfanekiso 2: Isimiso sesicupho sokukhanya sesakhiwo “sephiramidi”

Ukuhlaziywa kokumhlophe kwekristalu elilodwa

Ngokuskena i-electron microscope ku-white silicon wafer, kwatholakala ukuthi isakhiwo se-pyramid microstructure se-white wafer endaweni sasingakakhiwa, futhi ubuso babonakala bunesendlalelo sezinsalela "ezine-waxy", kuyilapho isakhiwo se-pyramid se-suede endaweni emhlophe ye-silicon wafer efanayo sakhiwe kangcono (bheka Umfanekiso 3). Uma kukhona izinsalela ebusweni be-monocrystalline silicon wafer, ubuso buzoba nendawo eseleyo enobukhulu besakhiwo "se-pyramid" kanye nokukhiqizwa okufanayo futhi umphumela wendawo evamile awanele, okuholela ekutheni ukubonakaliswa kobuso be-velvet obusele kuphakeme kunendawo evamile, indawo enokubonakaliswa okuphezulu uma kuqhathaniswa nendawo evamile ekubukekeni okubonakalayo okubonakala njengomhlophe. Njengoba kungabonakala ngesimo sokusatshalaliswa kwendawo emhlophe, akuyona isimo esijwayelekile noma esivamile endaweni enkulu, kodwa kuphela ezindaweni zasendaweni. Kufanele kube ukuthi ukungcola kwendawo ebusweni be-silicon wafer akukahlanzwa, noma isimo sobuso be-silicon wafer sibangelwa ukungcola kwesibili.

Umfanekiso 3: Ukuqhathaniswa komehluko wesakhiwo sesifunda kuma-wafer e-silicon amhlophe e-velvet

Ubuso be-wafer ye-silicon yokusika i-diamond wire bubushelelezi kakhulu futhi umonakalo mncane (njengoba kuboniswe kuMfanekiso 4). Uma kuqhathaniswa ne-wafer ye-silicon yokusika i-mortar, isivinini sokuphendula se-alkali kanye ne-wafer ye-silicon yokusika i-diamond wire sihamba kancane kunese-wafer ye-silicon yokusika i-mortar monocrystalline, ngakho-ke ithonya lezinsalela zobuso emphumeleni we-velvet lisobala kakhulu.

Umfanekiso 4: (A) I-micrograph engaphezulu ye-mortar cut silicon wafer (B) i-micrograph engaphezulu ye-diamond wire cut silicon wafer

Umthombo oyinhloko osele wobuso be-silicon wafer obusikiwe ngocingo lwedayimane

(1) Isipholisi: izingxenye eziyinhloko zesipholisi sokusika ucingo lwedayimane yi-surfactant, i-dispersant, i-defamagent kanye namanzi nezinye izingxenye. Uketshezi lokusika olusebenza kahle kakhulu lunokumiswa okuhle, ukuhlakazeka kanye nekhono lokuhlanza kalula. Ama-surfactants ngokuvamile anezakhiwo ezingcono ze-hydrophilic, okulula ukuzihlanza enkambisweni yokuhlanza i-silicon wafer. Ukuxuba okuqhubekayo nokujikeleziswa kwalezi zithasiselo emanzini kuzokhiqiza inani elikhulu le-foam, okuholela ekunciphiseni kokugeleza kwesipholisi, okuthinta ukusebenza kokupholisa, kanye nezinkinga ezinkulu ze-foam ngisho nokuchichima kwe-foam, okuzothinta kakhulu ukusetshenziswa. Ngakho-ke, isipholisi sivame ukusetshenziswa ne-agent ye-defoam. Ukuze kuqinisekiswe ukusebenza kwe-defoam, i-silicone yendabuko kanye ne-polyether ngokuvamile ayithandi i-hydrophilic. Isinyibilikisi emanzini kulula kakhulu ukusimunca futhi sihlale phezu kwe-silicon wafer ekuhlanzeni okulandelayo, okuholela enkingeni yebala elimhlophe. Futhi ayihambisani kahle nezingxenye eziyinhloko ze-coolant, Ngakho-ke, kumele yenziwe ibe yizingxenye ezimbili, Izingxenye eziyinhloko kanye nama-defoam agents afakwe emanzini, Enqubweni yokusebenzisa, ngokwesimo se-foam, Ayikwazi ukulawula ngobuningi ukusetshenziswa kanye nomthamo wama-antifoam agents, Ingavumela kalula ukweqisa kwama-anoaming agents, Okuholela ekwandeni kwezinsalela zomphezulu we-silicon wafer, Kuphinde kube nzima kakhulu ukusebenza, Kodwa-ke, ngenxa yentengo ephansi yezinto zokusetshenziswa kanye nezinto zokusetshenziswa zama-defoam agent, Ngakho-ke, iningi lama-coolant asekhaya asebenzisa lolu hlelo lwefomula; Esinye i-coolant sisebenzisa i-agent entsha yokudefoam, Ingahambisana kahle nezingxenye eziyinhloko, Akukho okungeziwe, Ingalawula ngempumelelo nangobuningi inani layo, Ingavimbela ngempumelelo ukusetshenziswa ngokweqile, Ukuzivocavoca nakho kulula kakhulu ukukwenza, Ngenqubo efanele yokuhlanza, Izinsalela zayo zingalawulwa emazingeni aphansi kakhulu, EJapane kanye nabakhiqizi abambalwa basekhaya basebenzisa lolu hlelo lwefomula, Kodwa-ke, ngenxa yezindleko zayo eziphezulu zezinto zokusetshenziswa, Inzuzo yayo yentengo ayibonakali.

(2) Uhlobo lweglue kanye neresin: esigabeni sakamuva senqubo yokusika ucingo lwedayimane, i-silicon wafer eduze kokuphela okungenayo isikiwe kusengaphambili, i-silicon wafer ekugcineni kokuphuma ayikakasikiwe, ucingo lwedayimane olusikiwe ekuqaleni luqale ukusika luye ongqimbeni lwerabha kanye nepuleti leresin, Njengoba iglue yenduku ye-silicon kanye nebhodi leresin zombili ziyimikhiqizo ye-epoxy resin, iphuzu layo lokuthambisa liphakathi kuka-55 no-95℃, Uma iphuzu lokuthambisa lwesendlalelo serabha noma ipuleti leresin liphansi, lingashisa kalula ngesikhathi senqubo yokusika futhi libangele ukuthi lithambe futhi lincibilike, Linamathele ocingweni lwensimbi kanye nobuso be-silicon wafer, Ngenxa yokuthi ikhono lokusika lomugqa wedayimane lehlile, Noma ama-silicon wafer amukelwa futhi afakwe i-resin, Uma enamathiselwe, kunzima kakhulu ukuwasha. Ukungcola okunjalo kwenzeka kakhulu eduze konqenqema lwe-silicon wafer.

(3) i-silicon powder: enkambisweni yokusika ucingo lwedayimane kuzokhiqiza i-silicon powder eningi, lapho ukusika kuqhubeka, okuqukethwe yi-mortar coolant powder kuzoba phezulu kakhulu, uma i-powder inkulu ngokwanele, izonamathela ebusweni be-silicon, futhi ukusika ucingo lwedayimane lwe-silicon powder ngobukhulu nosayizi kuholela ekumuncweni kwayo kalula ebusweni be-silicon, kwenze kube nzima ukuyihlanza. Ngakho-ke, qinisekisa ukuvuselelwa kanye nekhwalithi ye-coolant futhi unciphise okuqukethwe yi-powder ku-coolant.

(4) i-ejenti yokuhlanza: Ukusetshenziswa kwamanje kwabakhiqizi bokusika ucingo lwedayimane ikakhulukazi basebenzisa ukusika udaka ngesikhathi esifanayo, ikakhulukazi basebenzisa ukuhlanza kusengaphambili kokusika udaka, inqubo yokuhlanza kanye ne-ejenti yokuhlanza, njll., ubuchwepheshe bokusika ucingo olulodwa lwedayimane obuvela endleleni yokusika, bakha isethi ephelele yomugqa, ukusika okupholile kanye nodaka kunomehluko omkhulu, ngakho-ke inqubo yokuhlanza ehambisanayo, umthamo we-ejenti yokuhlanza, ifomula, njll. kufanele kube ukusika ucingo lwedayimane kwenze ukulungiswa okuhambisanayo. I-ejenti yokuhlanza iyisici esibalulekile, i-surfactant yokuqala ye-ejenti yokuhlanza, i-alkalinity ayifanele ukuhlanza i-wafer ye-silicon yokusika ucingo lwedayimane, kufanele ibe ngeye-wafer ye-silicon yokusika ucingo lwedayimane, ukwakheka kanye nezinsalela zobuso be-ejenti yokuhlanza eqondiwe, futhi ihambisane nenqubo yokuhlanza. Njengoba kushiwo ngenhla, ukwakheka kwe-ejenti yokuhlanza akudingeki ekusikeni udaka.

(5) Amanzi: ukusika ucingo lwedayimane, ukuwasha ngaphambi kokuhlanza nokuhlanza amanzi agcwele aqukethe ukungcola, angase afakwe ebusweni be-silicon wafer.

Nciphisa inkinga yokwenza izinwele ze-velvet zibe mhlophe iziphakamiso

(1) Ukusebenzisa i-coolant ngokuhlakazeka okuhle, futhi i-coolant iyadingeka ukusebenzisa i-agent yokuhlanza i-residue ephansi ukuze kuncishiswe insalela yezingxenye ze-coolant ebusweni be-silicon wafer;

(2) Sebenzisa i-glue efanele kanye ne-resin plate ukuze unciphise ukungcola kwe-silicon wafer;

(3) Isibandisi sixutshwa ngamanzi ahlanzekile ukuqinisekisa ukuthi akukho ukungcola okulula okusele emanzini asetshenzisiwe;

(4) Ukuze uthole ubuso be-wafer ye-silicon esikiwe ngocingo lwedayimane, sebenzisa umsebenzi kanye nomphumela wokuhlanza ofaneleka kakhulu;

(5) Sebenzisa uhlelo lokubuyisa i-diamond line coolant online ukunciphisa okuqukethwe yi-silicon powder enqubweni yokusika, ukuze ulawule ngempumelelo insalela ye-silicon powder ebusweni be-silicon wafer ye-wafer. Ngesikhathi esifanayo, kungandisa nokuthuthukiswa kwezinga lokushisa kwamanzi, ukugeleza kanye nesikhathi ekuhlanzweni kwangaphambili, ukuqinisekisa ukuthi i-silicon powder ihlanzwa ngesikhathi.

(6) Uma i-silicon wafer isibekwe etafuleni lokuhlanza, kumele iphathwe ngokushesha, futhi igcine i-silicon wafer imanzi phakathi nenqubo yonke yokuhlanza.

(7) I-silicon wafer igcina indawo imanzi ngesikhathi sokukhipha i-gum, futhi ayikwazi ukoma ngokwemvelo. (8) Enqubweni yokuhlanza i-silicon wafer, isikhathi esivezwa emoyeni singancishiswa ngangokunokwenzeka ukuze kuvinjelwe ukukhiqizwa kwezimbali ebusweni be-silicon wafer.

(9) Abasebenzi bokuhlanza akumele bathinte ngqo ubuso be-silicon wafer phakathi nenqubo yonke yokuhlanza, futhi kumele bagqoke amagilavu ​​​​erabha, ukuze bangakhiqizi ukuphrinta izigxivizo zeminwe.

(10) Esibonelweni [2], ukuphela kwebhethri kusebenzisa inqubo yokuhlanza ye-hydrogen peroxide H2O2 + alkali NaOH ngokwesilinganiso sevolumu esingu-1:26 (isixazululo se-3%NaOH), esinganciphisa ngempumelelo ukwenzeka kwenkinga. Isimiso sayo sifana nesisombululo sokuhlanza se-SC1 (esaziwa ngokuthi uketshezi 1) se-semiconductor silicon wafer. Indlela yaso eyinhloko: ifilimu ye-oxidation ebusweni be-silicon wafer yakhiwa yi-oxidation ye-H2O2, egqwala yi-NaOH, futhi i-oxidation kanye nokugqwala kwenzeka ngokuphindaphindiwe. Ngakho-ke, izinhlayiya ezinamathele ku-silicon powder, i-resin, insimbi, njll.) nazo ziwela oketshezini lokuhlanza ngesendlalelo sokugqwala; ngenxa ye-oxidation ye-H2O2, izinto eziphilayo ebusweni be-wafer ziyabola zibe yi-CO2, i-H2O futhi zisuswe. Le nqubo yokuhlanza ibilokhu isetshenziswa abakhiqizi be-silicon wafer besebenzisa le nqubo ukucubungula ukuhlanzwa kwe-diamond wire cutting monocrystalline silicon wafer, i-silicon wafer ekhaya naseTaiwan kanye nabanye abakhiqizi bebhethri abasebenzisa izikhalazo zezinkinga ezimhlophe ze-velvet. Kukhona futhi abakhiqizi bebhethri abasebenzise inqubo efanayo yokuhlanza i-velvet, futhi balawula ngempumelelo ukubukeka kwe-velvet white. Kungabonakala ukuthi le nqubo yokuhlanza ifakwa enkambisweni yokuhlanza i-silicon wafer ukuze kususwe izinsalela ze-silicon wafer ukuze kuxazululwe ngempumelelo inkinga yezinwele ezimhlophe ekugcineni kwebhethri.

isiphetho

Njengamanje, ukusika ucingo lwedayimane sekuyindlela eyinhloko yokucubungula emkhakheni wokusika ikristalu elilodwa, kodwa enkambisweni yokukhuthaza inkinga yokwenza i-velvet emhlophe ibilokhu ikhathaza abakhiqizi be-silicon wafer kanye namabhethri, okuholela ekutheni abakhiqizi bebhethri banqume ucingo lwedayimane, i-silicon wafer inokumelana okuthile. Ngokuhlaziya ukuqhathanisa indawo emhlophe, kubangelwa kakhulu yinsalela ebusweni be-silicon wafer. Ukuze kuvinjelwe kangcono inkinga ye-silicon wafer esitokisini, leli phepha lihlaziya imithombo engaba khona yokungcoliswa kobuso be-silicon wafer, kanye neziphakamiso zokuthuthukisa kanye nezilinganiso ekukhiqizeni. Ngokwenani, isifunda kanye nesimo samabala amhlophe, izimbangela zingahlaziywa futhi zithuthukiswe. Kunconywa kakhulu ukusebenzisa i-hydrogen peroxide + inqubo yokuhlanza i-alkali. Okuhlangenwe nakho okuphumelelayo kuye kwafakazela ukuthi kungavimbela ngempumelelo inkinga yokusika ucingo lwedayimane i-silicon wafer ekwenzeni i-velvet whitening, ukuze kubhekwe abangaphakathi nabakhiqizi abajwayelekile embonini.